Jianping Zeng

Incoming tenure-track Assistant Professor

School of Computing and Augmented Intelligence (SCAI)

Arizona State University (ASU)

Email: jpzeng92 (at) gmail (dot) com

Google Scholar DBLP

Biography

I am a computer architecture researcher in the Samsung Memory Solutions Lab (MSL) with a Ph.D. degree in Computer Science from Purdue University where I was fortunately advised by Prof. Changhee Jung. Prior to joining Purdue University, I worked as a compiler engineer with focuses on optimizing the middle-end and backend of GCC (GNU Compiler Collection) for CSKY architecture (an embedded architecture widely used in network switch, printer, etc) of Alibaba T-Head Semiconductor.

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Research

My research interest lies in compiler and computer architecture. Specifically, I aim to co-design compiler and computer architecture to address performance and reliability issues of CPUs/GPUs/memory systems for modern complex workloads. As a computer architecture researcher in the Samsung MSL, I work on hardware/software co-design for high-performance memory products, e.g., CXL (Computing eXpress Link)-based memory and processing-in-memory (PIM). While I was a Ph.D. student at Purdue University, I designed reliable and performant computing systems, ranging from embedded systems to server-class systems, against soft errors and crash consistency issues resulting from power failures. To achieve that, I usually co-design compilers and architectures to maintain minimal hardware complexity while achieving high performance. My research works are typically published at top-tier conferences in the fields of computer architecture, high-performance computing (HPC), and programming languages, e.g., ISCA, MICRO, ICS, HPDC, and PLDI.

5 first-author publications in top computer architecture/HPC conferences: (1) MICRO'21x2, (2) MICRO'23, (3) ISCA'24, (4) ICS'24.
7 second-author publications in top computer system conferences: (1) PLDI'20, (2) HPDC'22, (3) ISCAx2, (4) MICROx2, (5) RTSS'23.

News

• May 2025: Invited to serve on the program committee (PC) of CGO 2026
• April 2025: Congratulations to Gan on IPEX selected as Best Paper Candidate at ISCA 2025!
• March 2025: Our paper about performance analysis of Samsung CMM-H accepted to IEEE Micro Special Issue. Please keep in touch for the final copy.
• March 2025: IPEX accepted to ISCA 2025, congratulation to Gan. This is the pride of being a mentor!
• March 2025: Invited to serve on the program committee (PC) of LCTES 2025
• March 2025: Invited to serve on the program committee (PC) of MICRO 2025
• January 2025: Invited to serve on the program committee (PC) of CF 2025
• November 2024: Invited to serve on the program committee (PC) of ICS 2025
• November 2024: Invited to serve on the program committee (PC) of ISCA 2025
• August 2024: I will be joining the Memory Solutions Lab at Samsung Semiconductor as a Computer Architect!
• July 2024: Invited to join the program committee (PC) of PPoPP'25
• July 2024: LightWSP accepted to MICRO 2024, congratulation to Yuchen. This is the pride of being a mentor!
• June 2024: I successfully defended my thesis!
• April 2024: VeriPipe accepted to ICS 2024
• March 2024: cWSP accepted to ISCA 2024
• March 2024: Receive the Merit Recognition Award from the CS department at Purdue. Big thanks to the department and my advisor!
• February 2024: PPA is nominated as Memorable Paper Award Finalist at NVMW 2024!
• February 2024: 3 papers accepted to NVMW 2024
• July 2023: RTailor accepted to RTSS 2023
• July 2023: PPA and SweepCache accepted to MICRO 2023
• March 2023: WL-Cache accepted to ISCA 2023. Thanks a lot to my collaborators.
• March 2023: I will join Memory Solutions Lab (MSL) of Samsung Semiconductor, Inc as a System Architecture Intern this summer.
• Feb 2023: One paper accepted to NVMW 2023
• April 2022: One paper accepted to NVMW 2022
• March 2022: One paper accepted to HPDC 2022
• March 2022: I will join the Computing Technology Lab of Alibaba Group, US this summer as a Research Intern focusing on computer architecture.
• July 2021: Two papers (ReplayCache and Turnpike) accepted to MICRO 2021
• February 2020: One paper (Penny) accepted to PLDI 2020

Publications

[TOP-TIER] tag is used to mark the paper that appears in one of the top CS conferences selected by csrankings.org.


• Performance Characterizations and Usage Guidelines of Samsung CXL Memory Module Hybrid Prototype [PDF]
  Jianping Zeng, Shuyi Pei, Da Zhang, Yuchen Zhou, Amir Beygi, Xuebin Yao, Ramdas Kachare, Tong Zhang, Zongwang Li, Marie Nguyen, Rekha Pitchumani, Yang Seok Ki, Changhee Jung
  IEEE Micro Special Issue (Impact Factor: 3.6)
  
  
• Rethinking Prefetching for Intermittent Computing
  Gan Fang, Jianping Zeng, Aditya Gupta, and Changhee Jung
  [TOP-TIER] 52th International ACM/IEEE Symposium on Computer Architecture (ISCA),Tokyo, Japan, June 2025.
  Acceptance rate: 22.3% (127 out of 570 submissions)
  Nominated as Best Paper Candidate
  
  
• LightWSP: Whole-System Persistence on the Cheap [PDF]
  Yuchen Zhou, Jianping Zeng, Changhee Jung
  [TOP-TIER] 57th International IEEE/ACM Symposium on Microarchitecture (MICRO), Austin, Texas, November 2024.
  Acceptance rate: 22.7% (113 out of 497 submissions)
  
  
• Compiler and Architecture Co-design for Reliable Computing [PDF]
  Jianping Zeng
  Doctoral Dissertation, Department of Computer Science, Purdue University, August 2024.
  
  
• Compiler-Directed Whole-System Persistence [PDF] [PPT]
  Jianping Zeng, Tong Zhang, Changhee Jung
  [TOP-TIER] 51th International ACM/IEEE Symposium on Computer Architecture (ISCA), Buenos Aires, Argentina, June 2024.
  Acceptance rate: 19.6% (83 out of 423 submissions)
  
  
• Soft Error Resilience at Near-Zero Cost [PDF] [PPT]
  Jianping Zeng, Shao-Yu Huang, Jiuyang Liu, Changhee Jung
  [TOP-TIER] 38th ACM International Conference on Supercomputing (ICS), Kyoto, Japan, June 2024.
  
  
• RTailor: Parameterizing Soft Error Resilience for Mixed-Criticality Real-Time Systems [PDF]
  Shao-Yu Huang, Jianping Zeng, Xuanliang Deng, Sen Wang, Ashrarul Haq Sifat, Burhanuddin Bharmal, Jia-Bin Huang, Ryan Williams, Haibo Zeng and Changhee Jung
  [TOP-TIER] 44th International IEEE Real-Time Systems Symposium (RTSS), Taipei, December 2023.
  
  
• Persistent Processor Architecture [PDF] [PPT]
  Jianping Zeng, Jungi Jeong, Changhee Jung
  [TOP-TIER] 56th International IEEE/ACM Symposium on Microarchitecture (MICRO), Toronto, Canada, October 2023.
  Acceptance rate: 23.8% (101 out of 404 submissions)
  Nominated as Memorable Paper Finalist in NVMW'24
  
  
• SweepCache: Intermittence-Aware Cache on the Cheap [PDF] [PPT]
  Yuchen Zhou, Jianping Zeng, Jungi Jeong, Jongouk Choi, Changhee Jung
  [TOP-TIER] 56th International IEEE/ACM Symposium on Microarchitecture (MICRO), Toronto, Canada, October 2023.
  Acceptance rate: 23.8% (101 out of 404 submissions)
  
  
• Write-Light Cache for Energy Harvesting Systems [PDF]
  Jongouk Choi, Jianping Zeng, Dongyoon Lee, Changwoo Min, Changhee Jung
  [TOP-TIER] 50th International ACM/IEEE Symposium on Computer Architecture (ISCA), Orlando, USA, June 2023.
  Acceptance rate: 21% (79 out of 373 submissions)
  
  
• Capri: Compiler and Architecture Support for Whole-System Persistence [PDF] [PPT]
  Jungi Jeong, Jianping Zeng, Changhee Jung
  [TOP-TIER] 31th International ACM Symposium on High-Performance Parallel and Distributed Computing (HPDC), Minneapolis, USA, June 2022.
  Acceptance rate: 19% (21 out of 108 submissions)
  
  
• ReplayCache: Enabling Volatile Caches for Energy Harvesting Systems [PDF] [PPT]
  Jianping Zeng, Jongouk Choi, Xinwei Fu, Ajay P. Shreepathi, Dongyoon Lee, Changwoo Min, and Changhee Jung
  [TOP-TIER] 54th IEEE/ACM International Symposium on Microarchitecture (MICRO), Online, October 2021.
  Acceptance rate: 21.8% (94 out of 430 submissions)
  
  
• Turnpike: Lightweight Soft Error Resilience for In-Order Cores [PDF] [PPT]
  Jianping Zeng, Hongjune Kim, Jaejin Lee, and Changhee Jung
  [TOP-TIER] 54th IEEE/ACM International Symposium on Microarchitecture (MICRO), Online, October 2021.
  Acceptance rate: 21.8% (94 out of 430 submissions)
  
  
• Compiler-Directed Soft Error Resilience for Lightweight GPU Register File Protection [PDF]
  Hongjune Kim, Jianping Zeng, Qingrui Liu, Mohammad Abdel-Majeed, Jaejin Lee, and Changhee Jung
  [TOP-TIER] 41th ACM SIGPLAN Conference on Programming Language Design and Implementation (PLDI), Online, June 2020.
  Acceptance rate: 22.5% (77 out of 341 submissions)
  

Teaching

• CS 352 Guest Lecture (Purdue University): Compilers: Principles and Practice (Fall 2023)
• CS 502 Guest Lecture (Purdue University): Compiling and Programming Systems (Spring 2024)

Mentees

• Shao-Yu Huang, PhD student at Purdue University
• Yuchen Zhou, PhD student at Purdue University
• Gan Fang, PhD student Purdue University
• Yongjie Huang, Master student at Xi'an Jiaotong University; Next step: PhD student at Purdue University

Honors & Awards

• Memorable Paper Finalist in NVMW 2024
• Merit Recognition Award from the CS department at Purdue (top 10% among faculty, staff, post-docs, and grads)
• Travel Award: NVMW (2022, 2023), MICRO (2023), ISCA (2024), ICS (2024)

Academic Service

• Organization Committee
  
  Languages, Compilers, Tools and Theory of Embedded Systems (LCTES): 2020 (Web Chair)
  International Conference on Parallel Architectures and Compilation Techniques (PACT): 2025 (Registration Chair)
• Program Committee
  
  Principles and Practice of Parallel Programming (PPoPP): 2025 (PC)
  International Symposium on Computer Architecture (ISCA): 2025 (LPC)
  International Conference on Supercomputing (ICS): 2025 (PC)
  International Conference on Computing Frontiers (CF): 2025 (PC)
  International Symposium on Microarchitecture (MICRO): 2025 (PC)
  Languages, Compilers, Tools and Theory of Embedded Systems (LCTES): 2025 (PC)
  International Symposium on Code Generation and Optimization (CGO): 2026 (PC)
• Journal Reviewer
  
  ACM Transactions on Architecture and Code Optimization (TACO): 2023-2025
  ACM Transactions on Embedded Computing Systems (TECS): 2024
  IEEE Computer Architecture Letter (CAL): 2022, 2024
  IEEE Transactions on Computers (TC): 2024

Work Experience

• Computer Architecture Researcher: August 2024 - Present, Samsung Memory Solutions Lab (MSL)
  
• Research Intern: May 2023 - August 2023, Samsung Memory Solutions Lab (MSL)
  
• Research Intern: May 2022 - August 2022, Alibaba DAMO Academy
  
• Senior Compiler Engineer: June 2017 - July 2018, Alibaba
  
• Software Engineer Intern: June 2016 - August 2016, Alibaba