Jianping Zeng

Ph.D. in Computer Science

Computer Architecture Researcher at Samsung Semiconductor Inc.
3655 N First St, San Jose, CA 95134, USA
Email: zeng207 (at) purdue (dot) edu
Email: jpzeng92 (at) gmail (dot) com

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Biography

I am a computer architecture researcher in the Samsung Memory Solutions Lab (MSL) with a Ph.D. degree in Computer Science from Purdue University where I was fortunately advised by Prof. Changhee Jung. In the meanwhile, I also closely work with Prof. Dongyoon Lee at Stony Brook University, Prof. Trevor E. Carlson at National University of Singapore, and Prof. Jongouk Choi at University of Central Florida. Prior to joining Purdue University, I worked as a compiler engineer with focuses on optimizing the middle-end and backend of GCC (GNU Compiler Collection) for CSKY architecture (an embedded architecture widely used in network switch, printer, etc) of Alibaba T-Head Semiconductor.

Research

As a computer architecture researcher in the Samsung MSL, I work on hardware/software co-design for high-performance memory products, such as next generation high bandwidth memory (HBM), CXL (Computing eXpress Link)-based memory, processing-in-memory (PIM), and their applications for artificial intelligence and large language models (LLMs). While I was a Ph.D. student at Purdue University, I designed reliable and performant computing systems, ranging from embedded systems to server-class systems, against soft errors and crash consistency issues resulting from power failures. To achieve that, I usually co-design compilers and architectures to maintain minimal hardware complexity while achieving high performance. My research works are typically published at top-tier conferences in the fields of computer architecture, high-performance computing (HPC), and programming languages, e.g., ISCA, MICRO, ICS, HPDC, and PLDI.

5 first-author publications in top computer architecture/HPC conferences: (1) MICRO'21x2, (2) MICRO'23, (3) ISCA'24, (4) ICS'24.
7 second-author publications in top computer system conferences: (1) PLDI'20, (2) HPDC'22, (3) ISCAx2, (4) MICROx2, (5) RTSS'23.

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